Wafer warpage stress measuring instrument-Global supplier

Shanghai Nateng Instrument Co., Ltd

Product Groups

NX-HDM fully automatic defect detection atomic force microscope
P17 automatic wafer probe profilometer/stair step meter
NX Wafer Fully Automated Wafer Inspection Atomic Force Microscope
NX-3DM Rotating Fully Automatic Atomic Force Microscope
Nano observer electrical atomic force microscope
Cathodic Fluorescence Imaging Spectral Detection System
Multi functional maskless laser direct writing
Optical surface defect analyzer
Explorer Electron Beam, Magnetron, Thermal Evaporation Thin Film Deposition
DV-502 Thermal Evaporation Thin Film Deposition
Desktop Pro Thin Film Deposition - Magnetron Sputtering
BenchTop Turbo Thermal Evaporation and Sample Preparation
Desk V Thin Film Deposition Solution
Hyperspectral microscope
Freeform Surface 3D Shape Tester
Wafer warpage stress measuring instrument
Internal stress detector
Semi automatic wafer bonding machine
proximity aligner
Array pressure sensing system
Atomic layer deposition system ALD products
Electron microscope sample cleaning machine
CMP20 electrochemical mechanical polishing machine
Laser interference lithography machine
VITA reactive ion etching machine (vertical chamber)
COWIN High Throughput Integrated Plasma Reaction Ion Etching Cleaning System
LAVIDA Paraxylene Coating Equipment
Co series desktop plasma etching machine cleaning machine
CLONE dual-mode plasma etching machine cleaning machine
Liquid particle size analyzer
EzAFM portable atomic force microscope
Laser sampling
Precision glass cutting machine (desktop type)
ADR low-temperature constant temperature dry mK system
Liquid Particle Sizer - LPC
High temperature 3D printer
Block resistance tester
S100 type digital source table
NX12 Biological Atomic Force Microscope
Zeta-388 automatic multi-mode optical profilometer
TS200-HP high-power probe station
Zeta-300 multi-mode optical profilometer
TS2000-DP high-power probe station
TS50 manual small probe station
TS2500-RF Fully Automatic RF Probe Station
TS3000 automatic probe station
MicroXAM800 White Light Interferometer
TS300 12 inch manual probe station
MDO34 oscilloscope
In situ AFM in SEM
Pulse laser deposition system (PLD)
Active Vibration Isolation Platform AMT
Duramin-100 hardness tester
3-inch nanoimprint machine NIL75
In situ automatic nanomanipulation system
In situ MEMS chips and synchrotron radiation holders
In SEM HT high-temperature in-situ nanoindentation instrument
Duramin-4 hardness tester
High temperature in-situ nanoindentation instrument
Active isolation table ARISTT
Active isolation table ARISMD
Passive vibration isolation SOTOT
Passive isolation table GWA-M
Passive isolation table GWA-TO
Active isolation table PMT
Diener Pico plasma cleaning machine
Diener FEMTO plasma cleaning machine
FT-NMT04 Nano Mechanical Performance Testing System
ACCUTOM-10/-100 cutting equipment
X1 series digital adjustable drying cabinet
EZ series stereomicroscope
DM 4500P semi-automatic intelligent digital polarizing microscope
Leica M Series Stereoscopic Microscope LeicaM165FC/205FA
S series stereomicroscope
Leica M Series Stereoscopic Microscope LeicaM125/165C/205C/205A
DM750P professional polarizing microscope
EUV/X-ray reflector
X-ray Fresnel zone plate (FZP)
Grating template
MPI Titan RF Accessories
GGB microwave probe
Quantifoil porous mesh carrier
GGB calibration standard sample
Customized vibration isolation system
Ion beam etching/deposition system
Silicon nitride thin film window
AFM substrate
AFM probe
MPI RF calibration substrate
GGB active high impedance needle tip
GGB DC probe
Hole shaped template
Prism coupler
Duramin-40 hardness tester
4-inch nanoimprint machine NIL-100
Leica room temperature ultra-thin slicer Leica EM UC7
Film thickness measuring instrument
BI-2500 desktop surface plasmon resonance analyzer
Established Active Vibration Isolation Platform
BI-4500 high-throughput fully automatic surface plasmon resonance analyzer
TS150-HP high-power probe station
Scanwave Scanning Microwave Near Field Impedance Microscope
MVI scattering scanning near-field optical microscope
TS150 6-inch manual probe station
4200A-SCS parameter analyzer
F40 Microscopic Film Thickness Measuring Instrument
Zeta20 multi-mode 3D optical profilometer

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Room 707, Aiqian Building, 599 Lingling Road, Xuhui District, Shanghai, China

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Wafer warpage stress measuring instrument

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Stress Mapper Wafer warpage stress measuring instrument

Capable of detecting three-dimensional warping (flatness) and film stress, suitable for semiconductor wafer production, semiconductor process development, glass and ceramic wafer production

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