cleaning-scheme
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idea
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DRY cleaning technology
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CO2 particle cleaning technology
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Plasma cleaning technology
idea
The Importance of Cleaning Process
In the manufacturing industry, achieving high quality, high throughput, high output, and low inventory in production is very important.
With the growing popularity of Internet, communication technology and information processing technology, especially for semiconductor manufacturing equipment, the importance of cleaning process is self-evident.
The cleaning process is crucial in enhancing the value of the customer's enterprise.
2. Hitachi's high-tech cleaning solution
Exclude foreign particles and pollutants
For many years, our company has been committed to the production and manufacturing of semiconductor manufacturing equipment, precision analytical instruments, and more.
Analysis of foreign particles and pollutants
Many customers are using our company's electron microscopes, various analysis devices, and foreign object inspection equipment.
Remove foreign particles and pollutants
Our company has provided many customers with cleaning systems including WET/DRY cleaning technology and environmental control technology.
On the basis of this technology and experience, combined with technical cooperation with partners and digital technology
Hitachi High Tech is committed to providing the best solutions for customers' cleaning problems.
3. Create value through cooperation with customers in the cleaning process
It is important to accumulate skills and experience in one's own company. But not all technologies need to be established within one's own company.
We respond to market demands with the fastest speed and competitive prices.
Working with customers to solve cleaning problems is exactly the philosophy of Hitachi High Tech.
Customer Support System
DRY cleaning technology
Quality Science CleanLogix Technology
Our company's goal is to solve customers' cleaning problems with low environmental load DRY cleaning technology as the core.
Applicable process
- Particle removal
- Organic foreign matter and residue removal
- Surface improvement
- Removal of film stripping agent
Applicable fields
- Electronic components
- semiconductor
- Ultra precision machinery
- optics
- automobile
- medical equipment
- Food and beverage equipment
- spray painting
- Mold Forming
Cleaning Examples in CMOS Lens Assembly Process
① Object components
② Existing methods
- Removal of organic matter and attached foreign particles from monomers
- Blow off foreign particles mixed in during assembly with air
→ Quality issue: Organic matter and attached foreign particles inside the lens are difficult to remove completely
③ Countermeasures
④ Automation (Example)
CO2 particle cleaning technology
Quality Science CleanLogix Technology
Cleaning principle
- The generated CO2 particles are ejected together with the auxiliary gas
(Auxiliary gas: clean dry air or N2) - CO2 particles liquefy when impacted on the object being cleaned
Liquid CO2 drilling into the edge of foreign objects
Peel off foreign particles from the surface (physical cleaning)
And it undergoes dissolution reaction with organic matter (chemical cleaning) - Liquid CO2 undergoes gasification, carrying foreign particles and organic matter away from the surface of the object being cleaned to achieve cleaning
Cleaning Example
oil-based
before cleaning
after cleaning
Lens (fingerprint, oil-based ink)
before cleaning
after cleaning
CMOS sensor pixel part (organic matter)
before cleaning
after cleaning
Specially
Using CO2 particle size control technology to generate optimal particles (0.5-500 μ m)
- Spray CO2 particles onto the object to be cleaned using auxiliary gases such as clean dry air
- Heating auxiliary gas can prevent condensation, and particles can achieve low damage cleaning
- The special nozzle structure can achieve high cleaning power and low CO2 loss
- Compared to using water and medication for cleaning, it is more environmentally friendly
(CO2 is a resource regenerated from exhaust gas)
Main patents
US7225819B2/US6656017B2/US6802961B2/US7601112B2/US7901540B2/US8021489B2/US5725154A/US7451941B2/US9381574B1/US9352355B1/ US9387511B1/US8197603B2/US6979362B2/TWI577452B
Appearance of the device
applied technology
Plasma Composite Technology
Plasma cleaning technology
Quality Science CleanLogix Technology
The precision surface treatment technology using plasma is constantly evolving.
The main reactions that occur during plasma treatment
Feature
- Realize micro cleaning that cannot be achieved by humidification cleaning
- Independent ICP technology can generate a wide range and high concentration of plasma
- Rich plasma types can be used for various purposes
CCP: Capacitive Coupled Plasma
ICP: Inductively Coupled Plasma
The purpose and effectiveness of plasma devices
purpose | Plasma type | working procedure | effect | area |
---|---|---|---|---|
Remove glue | vacuum type | After laser drilling treatment | DESMEAR | Flexible substrate, rigid substrate (Cleaning of small holes with a diameter of 20-100 μ m) |
clean | vacuum type Atmospheric pressure type |
Before joining Before resin sealing |
Improved adhesion Moisture level improvement |
Pre painting treatment for IC, LED, and LCD Pre bonding treatment of 5G material substrates such as LCP, PFA, PTFE, etc Shorten the time required for the degassing process of vacuum parts |
Surface improvement | vacuum type Atmospheric pressure type |
Before electroplating Before bonding and painting |
Improved sealing performance | Flexible substrate, rigid substrate LCD glass, OLED-ITO glass |
- Can remove resin residue generated during the processing of micro holes with a diameter of 100-20 μ m
- Can be used for cleaning of 5G new material substrates such as "LCP", "PFA", "PTFE" before bonding and painting treatment
And the adhesion improvement of the substrate after cleaning before painting treatment - Shorten the time required for the degassing process of vacuum parts
LCP: Liquid Crystal Polymer
PFA: PerFluoroAlkoxy
PTFE: PolyTetraFluoroEthylene
Device series
Vacuum plasma device
Vacuum cleaning device
Atmospheric pressure plasma device
(Remote control type)
Atmospheric pressure plasma device
(Arc jet type)
Applicable examples
<Example of Organic Matter Removal>
Vacuum plasma ABF material (CF4+O2 gas)
before cleaning
After cleaning
Vacuum plasma fingerprint sensor Descum (CF4+O2 gas)
<Surface Improvement Example>
Atmospheric pressure plasma (used for CDA)