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清洗方案

  • idea

  • DRY cleaning technology

  • CO2 particle cleaning technology

  • Plasma cleaning technology

idea

The Importance of Cleaning Process

In the manufacturing industry, achieving high quality, high throughput, high output, and low inventory in production is very important.

With the growing popularity of Internet, communication technology and information processing technology, especially for semiconductor manufacturing equipment, the importance of cleaning process is self-evident.

The cleaning process is crucial in enhancing the value of the customer's enterprise.

2. Hitachi's high-tech cleaning solution

Exclude foreign particles and pollutants
For many years, our company has been committed to the production and manufacturing of semiconductor manufacturing equipment, precision analytical instruments, and more.

Analysis of foreign particles and pollutants
Many customers are using our company's electron microscopes, various analysis devices, and foreign object inspection equipment.

Remove foreign particles and pollutants
Our company has provided many customers with cleaning systems including WET/DRY cleaning technology and environmental control technology.

On the basis of this technology and experience, combined with technical cooperation with partners and digital technology
Hitachi High Tech is committed to providing the best solutions for customers' cleaning problems.

3. Create value through cooperation with customers in the cleaning process

It is important to accumulate skills and experience in one's own company. But not all technologies need to be established within one's own company.

We respond to market demands with the fastest speed and competitive prices.

Working with customers to solve cleaning problems is exactly the philosophy of Hitachi High Tech.

実現高品质・高产量

Customer Support System

客戶支援系統

DRY cleaning technology

Quality Science CleanLogix Technology

Our company's goal is to solve customers' cleaning problems with low environmental load DRY cleaning technology as the core.

现存清洗方法的问题点

我公司的提案:「CO2微粒子技术」「等离子技术」为核心的清洗方案

Applicable process

  • Particle removal
  • Organic foreign matter and residue removal
  • Surface improvement
  • Removal of film stripping agent

Applicable fields

  • Electronic components
  • semiconductor
  • Ultra precision machinery
  • optics
  • automobile
  • medical equipment
  • Food and beverage equipment
  • spray painting
  • Mold Forming

Cleaning Examples in CMOS Lens Assembly Process

① Object components

② Existing methods

  1. Removal of organic matter and attached foreign particles from monomers
  2. Blow off foreign particles mixed in during assembly with air

→ Quality issue: Organic matter and attached foreign particles inside the lens are difficult to remove completely

③ Countermeasures

④ Automation (Example)

CO2 particle cleaning technology

Quality Science CleanLogix Technology

CO2微粒子清洗机 CL-JETSeries

Cleaning principle

清洗原理

  1. The generated CO2 particles are ejected together with the auxiliary gas
    (Auxiliary gas: clean dry air or N2)
  2. CO2 particles liquefy when impacted on the object being cleaned
    Liquid CO2 drilling into the edge of foreign objects
    Peel off foreign particles from the surface (physical cleaning)
    And it undergoes dissolution reaction with organic matter (chemical cleaning)
  3. Liquid CO2 undergoes gasification, carrying foreign particles and organic matter away from the surface of the object being cleaned to achieve cleaning

Cleaning Example

oil-based

清洗前
before cleaning

清洗后
after cleaning

Lens (fingerprint, oil-based ink)

清洗前
before cleaning

清洗后
after cleaning

CMOS sensor pixel part (organic matter)

清洗前
before cleaning

清洗后
after cleaning

Specially

Using CO2 particle size control technology to generate optimal particles (0.5-500 μ m)

  • Spray CO2 particles onto the object to be cleaned using auxiliary gases such as clean dry air
  • Heating auxiliary gas can prevent condensation, and particles can achieve low damage cleaning
  • The special nozzle structure can achieve high cleaning power and low CO2 loss
  • Compared to using water and medication for cleaning, it is more environmentally friendly
    (CO2 is a resource regenerated from exhaust gas)

Main patents

US7225819B2/US6656017B2/US6802961B2/US7601112B2/US7901540B2/US8021489B2/US5725154A/US7451941B2/US9381574B1/US9352355B1/ US9387511B1/US8197603B2/US6979362B2/TWI577452B

Appearance of the device

装置外观

applied technology

Plasma Composite Technology

等离子复合技术

Plasma cleaning technology

Quality Science CleanLogix Technology

The precision surface treatment technology using plasma is constantly evolving.

The main reactions that occur during plasma treatment

等离子处理时发生的主要反应

Feature

  1. Realize micro cleaning that cannot be achieved by humidification cleaning
  2. Independent ICP technology can generate a wide range and high concentration of plasma
  3. Rich plasma types can be used for various purposes

CCP: Capacitive Coupled Plasma
ICP: Inductively Coupled Plasma

The purpose and effectiveness of plasma devices

The purpose and effectiveness of plasma devices
purpose Plasma type working procedure effect area
Remove glue vacuum type After laser drilling treatment DESMEAR Flexible substrate, rigid substrate
(Cleaning of small holes with a diameter of 20-100 μ m)
clean vacuum type
Atmospheric pressure type
Before joining
Before resin sealing
Improved adhesion
Moisture level improvement
Pre painting treatment for IC, LED, and LCD
Pre bonding treatment of 5G material substrates such as LCP, PFA, PTFE, etc
Shorten the time required for the degassing process of vacuum parts
Surface improvement vacuum type
Atmospheric pressure type
Before electroplating
Before bonding and painting
Improved sealing performance Flexible substrate, rigid substrate
LCD glass, OLED-ITO glass
  • Can remove resin residue generated during the processing of micro holes with a diameter of 100-20 μ m
  • Can be used for cleaning of 5G new material substrates such as "LCP", "PFA", "PTFE" before bonding and painting treatment
    And the adhesion improvement of the substrate after cleaning before painting treatment
  • Shorten the time required for the degassing process of vacuum parts

LCP: Liquid Crystal Polymer
PFA: PerFluoroAlkoxy
PTFE: PolyTetraFluoroEthylene

Device series

真空等离子装置
Vacuum plasma device

真空清洗装置
Vacuum cleaning device

大气压等离子装置(远程控制式)
Atmospheric pressure plasma device
(Remote control type)

大气压等离子装置(电弧喷气式)
Atmospheric pressure plasma device
(Arc jet type)

Applicable examples

<Example of Organic Matter Removal>

Vacuum plasma ABF material (CF4+O2 gas)

清洗前
before cleaning

清洗后
After cleaning

Vacuum plasma fingerprint sensor Descum (CF4+O2 gas)

<Surface Improvement Example>

Atmospheric pressure plasma (used for CDA)

分析·检查技术请点击!

DRY清洗技术请点击!

环境技术(在准备)

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