TriboLab CMP leverages over 20 years of CMP expertise from its predecessor product (Bruker CP-4) to bring a complete set of features to the industry-leading TriboLab platform. The high precision and high repeatability generated by this equipment enable efficient identification, inspection, and continuous functional testing throughout the entire CMP process. TriboLab CMP is the only process development tool on the market that can provide a wide range of polishing pressures (0.05-50 psi), speeds (1 to 500 rpm), friction, acoustic emission, and surface temperature measurements, accurately and completely describing CMP processes and consumables.

A small-scale research and development professional system for CMP

Brooke's TriboLab CMP process and material characterization system is designed specifically for wafer polishing processes and is a reliable, flexible, and efficient desktop device.

• Reproduce full-size wafer polishing process conditions without shutting down production equipment
• Provide measurement repeatability and detail detection for * * * *
• Allow testing on small samples, saving significant costs compared to full wafer testing

On board diagnostic system can better understand the polishing process

• Provides more parameters for transient polishing processes than any other system on the market
• Data can be collected from the moment of contact with the polishing disc until the entire testing process
• Realize early process development decisions through more complete and detailed data

Flexible sample types, sizes, and installation configurations

• Polish any flat material, almost any correction disc, any polishing solution, and any polishing pad can be used
• Easy use of small-sized wafers below 100mm
• Multiple samples can be installed simultaneously for more flexible testing