Product Introduction
Picosecond laser microfabrication system:
The sea laser picosecond laser microfabrication system adopts the world's leading German 140W High power infrared and green dual band output picosecond solid-state laser, fully realizing high-precision and high-efficiency, high hardness brittle material microfabrication, suitable for drilling, cutting, and engraving of any material that is sensitive to heat and brittle to high hardness. Picosecond laser processing has a particularly narrow pulse width, high laser frequency, ultra-high peak power, and almost no thermal conduction, so there is no thermal impact or stress generation when processing materials that are sensitive to thermal effects. Picosecond laser processing is currently the most promising third-generation precision cold processing method in the laser industry, and it is the future development trend of the laser industry. It can be applied to micro hole drilling and fine cutting of all materials such as reinforced glass, ultra-thin metal sheets, ceramic substrates, sapphire substrates, etc. Currently, it is the mainstream. The application includes cutting the glass cover of mobile phones, Cutting and drilling of precision gear components in the high-end watch industry, and engraving and cutting of circuits in the semiconductor microelectronics industry.

Model features:
The HL-650 ultra fast picosecond laser microfabrication system adopts the multi axis laser control software independently developed by Haili Laser, which can support ① CCD visual automatic target finding ② XY platform precision motion large-size one-time seamless splicing ③ Laser and scanning galvanometer precision processing are synchronized, and can process a range of 650mm * 650mm at once. With ten years of software technology accumulation, mature and stable software technology, powerful editing functions, and the ability to automatically or manually cut large graphics, the splicing accuracy is up to ≤ 3um.
2. Powerful software features support multiple visual positioning features, such as cross, solid circle, hollow circle, cross plus hollow circle, L-shaped right angle edge, and image feature point positioning vision, which is very convenient for positioning without fixtures during processing!
3. The HL-650 picosecond laser microfabrication system uses a German made 355nm, 532nm, and 1064nm three band tunable femtosecond laser with a maximum laser power of 50W and a pulse width of only 10ps. The ultra short pulse width ensures that there is no thermal conduction during laser processing, so materials that are sensitive to thermal effects during processing have no thermal effects or stress generation. Picosecond laser processing is a precision cold processing method that can be applied to the processing of all materials such as paper, glass, metal, ceramics, sapphire, etc. Even when processing on materials such as explosives, there will be no explosion.

Applicable industries:
Mobile phone cover, optical glass, sapphire substrate, ultra-thin metal sheet material, ceramic substrate and other materials with micro hole drilling and fine cutting. Specific application industries include precision sensor ultrafine components, high-end watch gears, automotive engine fuel injector micro hole drilling, mobile phone glass cover drilling and cutting, and LED or high-temperature resistant PCB ceramic substrate circuit board small hole drilling and shape cutting with a diameter of 0.1mm or more.

Main technical parameters:

Parameter model	HL-650
Laser type	355nm 523nm 1064nm three band Rapid50W 10ps laser
Maximum laser power	50W
Minimum focused spot of laser	15um (355nm minimum area per unit 200mm x 200mm) 25um 1064um laser single maximum area
Maximum working range of laser in a single operation	67 × 67mm 15um line width 170 × 170mm 40um line width
Laser processing line splicing accuracy	≤±3um
Laser processing speed	100-3000mm/s adjustable
Maximum moving speed of XY platform	800mm/s 1G acceleration
XY platform repeatability accuracy	≤±1um
XY platform positioning accuracy	≤±3um
CCD positioning accuracy	≤±3um
Whole machine power supply	5kw/Ac220V/50Hz
Cooling method	Constant temperature water cooling
outline dimension	2300mm×2000mm×1950mm

Cut drilling sample image: