detailed parameters
Optimize innovation to make products faster, more stable, and more reassuring
model | DM300-IC |
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Laser power (W) | 20w |
Standard processing range (mm) | 50mm*50mm |
Equipment size (mm) | L*D*H=900*600*690mm |
CCD visual positioning system (mm) | 50 * 50mm, accuracy ± 0.05mm |
Visual surveillance system (mm) | 100*100mm |
Laser wavelength (nm) | 1064nm |
work environment | Temperature: 10-30 ℃, relative humidity: 40~75%, no condensation |
Visual surveillance system (mm) | 100*100mm |
laser device | Infrared Laser |
Product advantages
Integrating numerous functions to create more value for customers
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01
Configure a dual CCD vision system for real-time monitoring of visual positioning and processing processes;
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02
Professional laser light source, precise energy control, ensuring that the underlying materials such as bonding wires are not damaged during the laser opening process;
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03
Independently designed high-precision and high-speed galvanometers can achieve chip cover opening applications at different depths and thicknesses;
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04
The processing area is designed with a fully enclosed and environmentally friendly design, with manual lifting doors for safe and reliable processing;
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05
Adopting automatic lifting and focusing, simple and efficient, to achieve efficient processing requirements;
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06
Small scale instruments and equipment with small footprint, suitable for various applications such as laboratories.