The Contracx-200 optical profilometer offers advanced features, customizable selection of superior blends, and easy-to-use * best grade, fast, accurate, and repeatable non-contact 3D surface measurement. The small footprint system provides uncompromising 2D/3D high-resolution measurement capabilities, utilizing a larger FOV 5 MP digital camera and a new mobile XY stage. Due to its * * * * Z-axis resolution and accuracy, Contracx-200 offers all the industry recognized advantages of Bruker's proprietary white light interferometry (WLI) technology, without being limited by traditional confocal microscopes and standard optical profilometers.

No compromise, * good level metrology

Based on over 40 years of experience in WLI, the Con arc X-200 optical profilometer has demonstrated results of low noise, high speed, * *, and * *, which are necessary for quantitative metrology. By using multiple targets and integrated feature recognition, features can be tracked across different fields of view and sub nanometer vertical resolutions, providing independent results for the application of quality control and process monitoring in a very diverse industry. Contracx-200 is robust in all surface conditions, with reflectivity ranging from 0.05% to 100% The new hardware features include a stage design with greater splicing capability and a 5MP camera with a 1200x1000 measurement array to reduce noise, a larger field of view, and higher lateral resolution.

*Extensive application analysis capability

Using the powerful VisionXpress and Vision 64 user interface, Contracex-200 provides thousands of customized analyses for productivity on laboratory and factory floors. Bruker's new Universal Scanning Interferometer (USI) measurement mode provides fully automated, self sensing surface textures, optimized signal processing, as well as accurate and realistic calculations of the surface morphology being analyzed. The new camera of the system provides a larger field of view and the flexibility provided by the new maneuvering XY stage, allowing for more flexibility and higher throughput for a wide range of samples and components. The combination of hardware and software provides streamlined high optical performance that exceeds comparable metrological capabilities.